Wire wedge bonder equipment market is anticipated to grow at a CAGR of 3.0% during the forecast period. One of the prominent factors that fueled the market growth is the increasing modifications and advances in the manufacturing processes, coupled with the rising production of electronic products across the globe, and the advent of new chip packaging are the factors that droves the market revenue growth during the forecast period. Wedge bonder equipment provides electrical interconnects between a device chip and package using thin aluminum or gold wires, and is used to interconnect a broad range of technologies in various power semiconductor packages for several end-use industries such as automotive, industrial, and aerospace, among others. For instance, in august 2021, QP Technologies announced it has installed two new Hesse Mechatronics ultrasonic wire bonders at its wholly owned 20,000-square-foot facility. Adding these systems to the line enables to better address customer requirements for a wider range of substrate and chip types within core markets, as well as for new markets such as compact battery modules used in mobile and automotive applications.
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The global wire wedge bonder equipment market is segmented based on the material, shape, and end-user. Based on the material, the market is bifurcated into gold wire bonding, copper wire bonding, and aluminum wire bonding. Based on shape, the market is sub-segmented into ball bonding, wedge bonding, and flip-chip bonding. Based on end-user, the market is sub-divided into aerospace and defense, consumer electronics, automotive, healthcare, energy, telecommunications, and others.
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- Market Coverage
- Market number available for – 2023-2029
- Base year- 2022
- Forecast period- 2023-2029
- Segment Covered- By Source, By Product Type, By Applications
- Competitive Landscape- Archer Daniels Midland Co., Ingredion Inc., Kerry Group Plc, Cargill
- , and others
Market Segmentation
Global Wire Wedge Bonder Equipment Market by Material
- Gold Wire Bonding
- Copper Wire Bonding
- Aluminum Wire Bonding
Global Wire Wedge Bonder Equipment Market by Shape
- Ball Bonding
- Wedge Bonding
- Flip-Chip Bonding
Global Wire Wedge Bonder Equipment Market by End-User
- Aerospace and Defense
- Consumer Electronics
- Automotive
- Healthcare
- Energy
- Telecommunications
- Others
Regional Analysis
- North America
- United States
- Canada
- Europe
- UK
- Germany
- Italy
- Spain
- France
- Rest of Europe
- Asia-Pacific
- China
- India
- Japan
- South Korea
- Rest of Asia-Pacific
- Rest of the World
Company Profiles
- Amkor Technology
- Toray Engineering Co. Ltd.
- DIAS Automation
- F&K delvotec Bondtechnik gmbh
- Hesse GmbH
- Hybond Inc.
- JCET Group Co., Ltd.
- Kulicke and Soffa Industries, Inc.
- NEO Tech.
- Palomar Technologies, Inc.
- Powertech Technology Inc.
- SHINKAWA Electric Co., Ltd.
- TPT Wire Bonder GmbH & Co. KG
- ULTRASONIC ENGINEERING Co., LTD.
- West·Bond Inc
The Report Covers
- Market value data analysis of 2021 and forecast to 2028.
- Annualized market revenues ($ million) for each market segment.
- Country-wise analysis of major geographical regions.
- Key companies operating in the global wire wedge bonder equipment market. Based on the availability of data, information related to new product launches, and relevant news is also available in the report.
- Analysis of business strategies by identifying the key market segments positioned for strong growth in the future.
- Analysis of market entry and market expansion strategies.
- Competitive strategies by identifying ‘who-stands-where’ in the market.
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