The Wafer Level Packaging Market size is expected to grow at an annual average of 20% during 2021-2027. Wafer-level packaging (WLP) is used to interconnect electronic components such as resistors, capacitors, transistors, etc. on a single chip to create integrated circuits and utilize solder bumps deposited on chip pads. WLP allows wafer manufacturing, packaging, testing, and burn-in to be integrated at the wafer level to streamline the manufacturing process performed on the device.
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Company Profile
Amkor Technology
Applied Materials, Inc.
Brewer Science, Inc.
Deca Technologies
Fujitsu
Infineon Technologies AG
LAM RESEARCH CORPORATION
Siliconware Precision Industries Co., Ltd.
STATS ChipPAC Ltd
Tokyo Electron Limited
Market – Segmentation
By Integration Type
Fan-in WLP
Fan-out WLP
By Industry
Electronics
IT & Telecommunication
Industrial
Automotive
Aerospace & Defense
Healthcare
Others (Media & Entertainment and Non-Conventional Energy Resources)
By Bumping Technology
Copper Pillar
Solder Bumping
Gold Bumping
Others (Aluminum & Conductive Polymer Bumping)
Scope of the Report
The research study analyzes the Global Wafer Level Packaging Market industry from 360-degree analysis of the market thoroughly delivering insights into the market for better business decisions, considering multiple aspects some of which are listed below as:
Recent Developments
o Market Overview and growth analysis
o Import and Export Overview
o Volume Analysis
o Current Market Trends and Future Outlook
o Market Opportunistic and Attractive Investment Segment
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Geographic Coverage
o North America Market Size and/or Volume
o Latin America Market Size and/or Volume
o Europe Market Size and/or Volume
o Asia-Pacific Market Size and/or Volume
o Rest of the world Market Size and/or Volume
Key Questions Answered by Wafer Level Packaging Market Report
1. What was the Wafer Level Packaging Market size in 2019 and 2020; what are the estimated growth trends and market forecast (2021-2027).
2. What will be the CAGR of the Wafer Level Packaging Market during the forecast period (2021-2027)?
3. Which segments (product type/applications/end-user) were most attractive for investments in 2021? How these segments are expected to grow during the forecast period (2021-2027).
4. Which manufacturer/vendor/players in the Wafer Level Packaging Market was the market leader in 2020?
5. Overview on the existing product portfolio, products in the pipeline, and strategic initiatives taken by key vendors in the market.
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