Low pressure molding is a process commonly used to encapsulate, seal, and protect electronic components such as circuit boards using hot melt adhesives. Low pressure molding machines require far less material to provide delicate circuits with good sealing adhesion and temperature and solvent resistance. It offers complete waterproof encapsulation and enables custom designs that may […]
Tag Archives: Low Pressure Molding Machine Market
Low pressure molding is a process commonly used to encapsulate, seal, and protect electronic components such as circuit boards using hot melt adhesives. Low pressure molding machines require far less material to provide delicate circuits with good sealing adhesion and temperature and solvent resistance. It offers complete waterproof encapsulation and enables custom designs that may […]