The Molded Interconnect Devices MID Market size is expected to grow at an annual average of 14% during 2021-2027. Molded Interconnect Devices (MID) allow amalgamation of mechanical as well as electronic components and circuits directly on 3D plastic components. MIDs combine the housing, circuit board, cables, and circuit board that comprise traditional product interfaces and integrate them into a single functional, compact part.
The following segmentation are covered in this report:
By Process
- Laser Direct Structuring
- 2-Shot Molding
- Film Techniques
By Industry Vertical
- Consumer Electronics
- IT and Telecommunication
- Automotive
- Healthcare
- Aerospace and Defence
- Others
By Product
- Antennae and Connectivity Modules
- Connector and Switches
- Sensors
- Lighting
- Others
Scope of the report
The research study analyses the Molded Interconnect Devices MID Market industry from 360-degree analysis of the market thoroughly delivering insights into the market for better business decisions, considering multiple aspects some of which are listed below as:
Recent developments
- Market overview and growth analysis
- Import and export overview
- Volume analysis
- Current market trends and future outlook
- Market opportunistic and attractive investment segment
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Geographic Coverage
o North America Market Size and/or Volume
o Latin America Market Size and/or Volume
o Europe Market Size and/or Volume
o Asia-Pacific Market Size and/or Volume
o Rest of the world Market Size and/or Volume
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