The global molded interconnect device market is anticipated to grow at a considerable CAGR of 13% during the forecast period (2022-2028). The rise in adoption of molded interconnect technology across telecommunication equipment will propel the market growth. Several base station equipment used in telecommunication, such as routers, antenna systems, security shields, modules, telecom boxes and terminals are being designed by using molded interconnect technology. It combines the electrical and mechanical functions into single product and further improves the efficiency and reliability of telecommunication system. The telecommunication sector is evolving and expanding globally. The proliferation of 5G base stations in developed as well in developing countries, such as the US, France, China and Germany will accelerate the market growth.
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For instance, In July 2021, Vice minister of the ministry of industrial and information technology (MIIT) at China internet conference, announced that the China has deployed 916,000 5G base stations and number of 5G connected appliances & devices has crossed 365 million. A plan has been set up to expand the number of users to more than 560 million by 2023 along with 5G penetration rate exceeding 40%. Additionally, in December 2021, a credit rating agency – ICRA has revised its outlook on telecom sector. ICRA has estimated the operating profit of telecommunication industry to grow by approximately 30% in Financial Year 2023.
Market Coverage
- The market number available for – 2021-2028
- Base year- 2021
- Forecast period- 2022-2028
Segment Covered-
- By Process
- By Product Type
- By Industry
Regions Covered-
- North America
- Europe
- Asia-Pacific
- Rest of the World
Competitive Landscape- HARTING Technology Group, DuPont de Nemours, Inc., Ensinger India Engineering Plastics Pvt. Ltd., JOHNAN Corp., TE Connectivity Corp., Evonik Industries AG, LPKF Laser & Electronics AG, Molex LLC and others.
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Global Molded Interconnect Device Market Report by Segment
By Process
- Laser Direct Structuring
- Two – Shot Molding
- Film Technique
By Product Type
- Antennae and Connectivity Modules
- Connector and Switches
- Sensors
- Lighting
By Industry
- Medical
- Automotive
- Consumer Electronics
- Telecommunication
- Aerospace and Defence
Global Molded Interconnect Device Market Report by Region
North America
- United States
- Canada
Europe
- UK
- Germany
- Spain
- France
- Italy
- Rest of Europe
Asia-Pacific
- India
- China
- Japan
- South Korea
- Rest of APAC
Rest of the World
- Latin America
- Middle East & Africa
Company Profiles
- 2E Mechatronic
- Amphenol Corp
- Cicor Group
- DuPont de Nemours, Inc.
- Ensinger India Engineering Plastics Pvt. Ltd.
- Evonik Industries AG
- Fujitsu Ltd.
- Harting Technology Group
- JOHNAN Corp.
- LANXESS
- LPKF Laser & Electronics AG
- M.I.D Solutions Pty. Ltd.
- Molex LLC
- Multiple Dimensions AG
- RTP Co
- 7.16. RTP Company
- SelectConnect Technologies
- SINOPLAST GROUP LTD.
- TE Connectivity Corp.
- TEPROSA GmbH
- THALES
- Zeon Corp.
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