Microelectronics packaging market is anticipated to grow at a CAGR of 7.6% during the forecast period (2024-2031). Microelectronics packaging involves encasing and protecting microelectronic components such as Integrated Circuits (ICs) and semiconductors from external damage to ensure their smooth functionality and durability in various applications. It encompasses a range of packaging technologies, including Chip-On-Board (COB), Ball Grid Array (BGA), and flip-chip, which are essential for devices such as smartphones, computers, and automotive electronics. Further, the market is expected to experience significant growth in the future attributed to the growing miniaturization of electronic components, expanding application of microelectronics packaging in the automotive industry, increasing demand for packaging solutions in the consumer electronics industry, and rising adoption of the Internet of Things (IoT) and wearable technology.
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The automotive industry is increasingly integrating advanced electronics to improve navigation, safety, and infotainment systems in vehicles. This growing demand for sophisticated electronic features has increased the need for reliable and durable microelectronics packaging solutions. Electronic systems such as Advanced Driver Assistance Systems (ADAS), collision avoidance sensors, and high-definition infotainment displays require advanced packaging technologies that ensure high performance, robust thermal management, and long-term reliability under challenging automotive conditions. This increasing need for integrating advanced electronics drives the demand for microelectronic packaging in the automotive sector and is expected to expand the scope for microelectronics packaging beyond the consumer electronics market. For instance, in December 2023, Alpha and Omega Semiconductor Limited (AOS) introduced a new automotive TO-Leadless (TOLL) package for its automotive-grade 80V and 100V MOSFETs. The TOLL package is designed to enhance the company’s power semiconductors as essential components in the advancement of e-mobility for 2- and 3-wheel and other light vehicles. This new package helps meet the growing trend of electrifying vehicles with the latest battery technology to achieve clean energy zero-emission goals. AOS’s 80V and 100V MOSFETs are well-suited for automotive BLDC motor and battery management applications for e-mobility.
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- Market Coverage
- Market number available for – 2025-2031
- Base year- 2025
- Forecast period- 2025-2031
- Segment Covered- By Source, By Product Type, By Applications
- Competitive Landscape- Archer Daniels Midland Co., Ingredion Inc., Kerry Group Plc, Cargill
- , and others
Global Microelectronics Packaging Market Report Segment
By Packaging Type
- Ball Grid Array (BGA)
- Chip-on-Board (COB)
- Surface Mount Technology (SMT)
- Through-Hole Technology (THT)
- Package-on-Package (PoP)
- Flip-Chip
- System-in-Package (SiP)
By Technology
- Wafer-Level Packaging (WLP)
- Tape Carrier Package (TCP)
- Die-Level Packaging
- Others ((3D Packaging, And System-In-Package (SiP))
By Material Type
- Organic Substrates
- Ceramic Substrates
- Silicon Substrates
- Metal Substrates
By Application
- Consumer Electronics
- Automotive
- Healthcare
- Industrial
- Telecommunications
- Aerospace & Defense
- Energy
Global Microelectronics Packaging Market Report Segment by Region
North America
- United States
- Canada
Europe
- UK
- Germany
- Italy
- Spain
- France
- Rest of Europe
Asia-Pacific
- China
- India
- Japan
- South Korea
- Rest of Asia-Pacific
Rest of the World
- Latin America
- Middle East & Africa
The Report Covers
- Market value data analysis of 2023 and forecast to 2031.
- Annualized market revenues ($ million) for each market segment.
- Country-wise analysis of major geographical regions.
- Key companies operating in the global microelectronics packaging market. Based on the availability of data, information related to new product launches, and relevant news is also available in the report.
- Analysis of business strategies by identifying the key market segments positioned for strong growth in the future.
- Analysis of market-entry and market expansion strategies.
- Competitive strategies by identifying ‘who-stands-where’ in the market.
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