IO-Link is a short distance, bi-directional, digital, point-to-point, wired (or wireless), industrial communications networking standard (IEC 61131-9) used for connecting digital sensors and actuators to either a type of industrial fieldbus or a type of industrial Ethernet. Its objective is to provide a technological platform that enables the development and use of sensors and actuators that can produce and consume enriched sets of data that in turn can be used for economically optimizing industrial automated processes and operations. An IO-Link system consists of an IO-Link master and one or more IO-Link devices, i.e. Sensors or Actuators.
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Key Players
- SICK
- Siemens
- Murrelektronik
- ifm Electronic
- Rockwel Automation
- Beckhoff
- Baumer Group
- Turck
- WAGO
- Belden
- Bosch Rexforth
- Pepperl+Fuchs
- Balluff
- Wenglor
- Weidmüller
- Omron
IO-Link Breakdown Data by Type
- IO-Link Master
- IO-Link Sensor
- Others
IO-Link Breakdown Data by Application
- Machine Tool & Assembly Line
- Intralogistics
- Packaging
- Others
Scope of the Report
The research study analyses the global Global IO-Link Market industry from 360-degree analysis of the market thoroughly delivering insights into the market for better business decisions, considering multiple aspects some of which are listed below as:
Recent Developments
o Market Overview and growth analysis
o Import and Export Overview
o Volume Analysis
o Current Market Trends and Future Outlook
o Market Opportunistic and Attractive Investment Segment
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Geographic Coverage
o North America Market Size and/or Volume
o Latin America Market Size and/or Volume
o Europe Market Size and/or Volume
o Asia-Pacific Market Size and/or Volume
o Rest of the world Market Size and/or Volume
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(This release has been published on Global Market Post.
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