The die bonder equipment market is to grow from USD 820 million in 2019 to USD 972 million with an annual growth rate of 3% through 2028. Key factors driving the growth of the Die Bonder Equipment market include increasing demand for small electronic components and increasing adoption of stackable die technology in IoT devices. Die bounder equipment is a kind of semiconductor packaging and assembly equipment commonly used to attach chips to a package or substrate. Therefore, the matrix gluing device is widely used in the manufacture of semiconductor devices. Die fixing equipment is also known as die mounting equipment. The main function of the die fixing device is to select the die from the wafer or waffle tray and fix it to the substrate. In addition, for mounting the matrix on the substrate, epoxy, eutectic, various methods such as soft soldering and flip chip and like.be used.
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Company Profile
- ASM Pacific Technology Limited
- BE Semiconductor Industries N.V. (Besi)
- Tresky AG
- Finetech GmbH & Co KG.
- Kulicke & Soffa Industries, Inc.
- MicroAssembly Technologies, Ltd. (MAT)
- Mycronic AB
- Palomar Technologies Inc.
Market Segmentation
By Type
- Manual Die Bonders
- Semiautomatic Die Bonders
- Fully Automatic Die Bonders
By Bonding Technique
- Epoxy
- Eutectic
- Soft Solder
By Supply Chain Participant:
- OSAT Companies
- IDM Firms
By Device:
- Optoelectronics
- MEMS And MOEMS
- Power Devices
By Application:
- Consumer Electronics
- Automotive
- Industrial
Scope of the Report
The research study analyzes the Die Bonder Equipment industry from 360-degree analysis of the market thoroughly delivering insights into the market for better business decisions, considering multiple aspects some of which are listed below as:
Recent Developments
o Market Overview and growth analysis
o Import and Export Overview
o Volume Analysis
o Current Market Trends and Future Outlook
o Market Opportunistic and Attractive Investment Segment
Geographic Coverage
o North America Market Size and/or Volume
o Latin America Market Size and/or Volume
o Europe Market Size and/or Volume
o Asia-Pacific Market Size and/or Volume
o Rest of the world Market Size and/or Volume
Key Questions Answered by Die Bonder Equipment Market Report
1. What was the Die Bonder Equipment Market size in 2019 and 2020; what are the estimated growth trends and market forecast (2022-2028).
- What will be the CAGR of Die Bonder Equipment Market during the forecast period (2022-2028)?
3. Which segments (product type/applications/end-user) were most attractive for investments in 2022? How these segments are expected to grow during the forecast period (2022-2028).
4. Which manufacturer/vendor/players in the Die Bonder Equipment Market was the market leader in 2020?
5. Overview on the existing product portfolio, products in the pipeline, and strategic initiatives taken by key vendors in the market.
The report covers the following objectives:
- Proliferation and maturation of trade in the Die Bonder Equipment market.
- The market share of the Die Bonder Equipment market, supply and demand ratio, growth revenue, supply chain analysis, and business overview.
- Current and future market trends that are influencing the growth opportunities and growth rate of the Die Bonder Equipment market.
- Feasibility study, new market insights, company profiles, investment return, revenue (value), and consumption (volume) of the Die Bonder Equipment market.
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