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The Global 3D IC and 2.5D IC Market size is expected to grow at an annual average of 6.3% during 2021-2027. Key upcoming/trending technologies and products in the global market include heterogeneous 3D integration, hybrid memory cubes, computing and data centers, and 2D block assembly into 3D chips. This report provides a detailed analysis of the 3D IC and 2.5D IC market based on packaging technology, application, end-user industry and region.
A 3D IC (three-dimensional integrated circuit) is a package in which multiple layers of silicon wafers are stalked together with electronic components using through-silicon vias (TSV), whereas a 2.5-dimensional integrated circuit (2.5D IC) is a package. It uses active electronic components (such as dies or chips) laminated to an interposer via conductive bumps or TSVs.
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The following Segmentation are covered in this report:
By Packaging Technology:
- 3D wafer-level chip-scale packaging
- 3D TSV
- 2.5D
By Application:
- Logic
- Imaging & optoelectronics
- Memory
- MEMS/Sensors
- LED
- Power, analog & mixed signal, RF, photonics
By End-user Industry:
- Consumer electronics
- Telecommunication
- Industry sector
- Automotive
- Military and Aerospace
- Smart technologies
- Medical devices
The report covers the following objectives:
- Proliferation and maturation of trade in the global 3D IC and 2.5D IC Market.
- The market share of the global 3D IC and 2.5D IC Market, supply and demand ratio, growth revenue, supply chain analysis, and business overview.
- Current and future market trends that are influencing the growth opportunities and growth rate of the global 3D IC and 2.5D IC Market.
- Feasibility study, new market insights, company profiles, investment return, revenue (value), and consumption (volume) of the global 3D IC and 2.5D IC Market.
(This release has been published on Global Market Post. Global Market Post is not responsible for any content included in this release.)
