The global copper wire bonding market is anticipated to grow at a significant CAGR during the forecast period. Copper wire bonding is a wire bonding procedure in semiconductor packaging that uses copper wire instead of aluminium or gold wires in standard semiconductor packaging. Copper wire bonding began to appear in low-cost consumer-grade in 2018, eventually replacing gold wire bonding due to lower cost optimization. The growing gold costs, as well as the rising adoption of copper wire bonding in the automotive and consumer electronics industries, are propelling the global copper wire bonding market.
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Copper wire bonding is also utilised in a variety of applications across many industry verticals, including healthcare, military and defence, consumer electronics, automotive, aviation, and a few others. This has resulted in growing demand from manufacturers, which is driving the global copper wire bonding market growth over the forecast period. Copper wire bonding is also used in harsh environment applications because of their superior electrical and thermal conductivity, which enhance performance.
With rising market rivalry, both regional and global competitors are working on developing new items to maintain and strengthen their market position. To obtain an advantage over their competitors, major firms are focusing on merger and acquisition activity as well as technical development.For instance, In India, the government has initiated projects such as 100 smart cities and ‘Housing for All by 2022’ which are expected to immensely drive the copper wire bonding market in India through the forecast period.
Market Coverage:
- The market number available for – 2020-2027
- The base year – 2020
- The forecast period is from 2021 to 2027
Segment Covered-
- By Type
- By Application
Regions Covered
- North America
- Europe
- Asia-Pacific
- Rest of the Word
- Competitive Landscape: Freescale Semiconductor, Micron Technology, Cirrus Logic, Fairchild Semiconductor, Maxim, Integrated Silicon Solution.
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Copper Wire Bonding Market,
By Type
- 0-20 um
- 20-30 um
- 30-50 um
- Above 50 um
By Application
- Semiconductor Packaging
- PCB
- Others
Global Copper Wire Bonding Market by Region
North America
- United States
- Canada
Europe
- UK
- Germany
- Spain
- France
- Italy
- Rest of Europe
Asia-Pacific
- India
- China
- Japan
- South Korea
- Rest of APAC
Rest of the World
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- More than 120 countries are for analysis.
- Over 100+ paid data sources mined for investigation.
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