The global copper wire bonding market is anticipated to grow at a significant CAGR during the forecast period. Copper wire bonding is a wire bonding procedure in semiconductor packaging that uses copper wire instead of aluminium or gold wires in standard semiconductor packaging. Copper wire bonding began to appear in low-cost consumer-grade in 2018, eventually replacing gold wire bonding due to lower cost optimization. The growing gold costs, as well as the rising adoption of copper wire bonding in the automotive and consumer electronics industries, are propelling the global copper wire bonding market.
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With rising market rivalry, both regional and global competitors are working on developing new items to maintain and strengthen their market position. To obtain an advantage over their competitors, major firms are focusing on merger and acquisition activity as well as technical development.For instance, In India, the government has initiated projects such as 100 smart cities and ‘Housing for All by 2022’ which are expected to immensely drive the copper wire bonding market in India through the forecast period.
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- Market Coverage
- Market number available for – 2024-2031
- Base year- 2024
- Forecast period- 2024-2031
- Segment Covered- By Source, By Product Type, By Applications
- Competitive Landscape- Archer Daniels Midland Co., Ingredion Inc., Kerry Group Plc, Cargill
- , and others
Global Copper Wire Bonding Market,
By Type
- 0-20 um
- 20-30 um
- 30-50 um
- Above 50 um
By Application
- Semiconductor Packaging
- PCB
- Others
Global Copper Wire Bonding Market by Region
North America
- US
- Canada
Europe
- UK
- Germany
- Italy
- Spain
- France
- Rest of Europe
Asia-Pacific
- China
- India
- Japan
- Rest of Asia-Pacific
Rest of the World
- Latin America
- Middle East & Africa
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