Outsourced Semiconductor Assembly and Test Services (OSAT) market is anticipated to grow at a considerable CAGR of 8.4% during the forecast period. The increasing usage of OSAT in different industrial vertical is a key factor driving the growth of the global OSAT market. The considerable rise in the number of connected devices and consumer electronics, and the emphasis on quality improvement and end-to-end testing solutions by companies is a major motivator to the market growth. Additionally, the OSAT market is projected to benefit from the growing dominance of fabless market players in IC sales.
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The global OSAT market is segmented based on service, packaging type, and application. Based on service, the market is segmented into packaging and testing. Based on packaging type, the market is segmented into ball grid array packaging, chip-scale packaging, stacked die packaging, multi-chip packaging, and quad flat & dual-inline packaging. Based on application, the market is segmented into communication, consumer electronics, automotive, computing & networking, and industrial.
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- Market Coverage
- Market number available for – 2024-2031
- Base year- 2024
- Forecast period- 2024-2031
- Segment Covered- By Source, By Product Type, By Applications
- Competitive Landscape- Archer Daniels Midland Co., Ingredion Inc., Kerry Group Plc, Cargill
- , and others
Market Segmentation
Global Outsourced Semiconductor Assembly and Test Services (OSAT) Market By Packaging Type
- Ball Grid Array (BGA) Packaging
- Chip-scale Packaging (CSP)
- Stacked Die Packaging
- Multi-chip Packaging
- Quad Flat and Dual-inline Packaging
Global Outsourced Semiconductor Assembly and Test Services (OSAT) Market by Service Type
- Packaging
- Testing
Global Outsourced Semiconductor Assembly and Test Services (OSAT) Market by Application
- Communication
- Consumer Electronics
- Automotive
- Computing & Networking
- Industrial
- Other
Regional Analysis
- North America
- United States
- Canada
- Europe
- UK
- Germany
- Italy
- Spain
- France
- Rest of Europe
- Asia-Pacific
- China
- India
- Japan
- South Korea
- Rest of Asia-Pacific
- Rest of the World
Company Profiles
- Amkor Technology Inc.
- ASE Group
- Chipbond Technology Corp.
- ChipMOS Technologies Inc.
- Formosa Advanced Technologies Co. Ltd.
- Hana Micron Inc.
- Integrated Micro-electronics Inc.
- Jiangsu Changjiang Electronics Technology Co. Ltd.
- King Yuan Electronics Co. Ltd.
- Lingsen Precision Industries Ltd.
- Powertech Technology Inc.
- Tianshui Huatian Technology Co. Ltd.
- Tongfu Microelectronics Co.
- UTAC Holdings Ltd.
The Report Covers
- Market value data analysis of 2022 and forecast to 2030.
- Annualized market revenues ($ million) for each market segment.
- Country-wise analysis of major geographical regions.
- Key companies operating in the global OSAT market. Based on the availability of data, information related to new product launches, and relevant news is also available in the report.
- Analysis of business strategies by identifying the key market segments positioned for strong growth in the future.
- Analysis of market-entry and market expansion strategies.
- Competitive strategies by identifying ‘who-stands-where’ in the market.
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